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[ 英語タイトル ] Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023


Product Code : MNMSE00110177
Survey : MarketsandMarkets
Publish On : February, 2021
Category : Semiconductor and Electronics
Study Area : Global
Report format : PDF
Sales price option (consumption tax not included)
Single User USD5650 / Question Form
5 User USD6650 / Question Form
Enterprise User USD10000 / Question Form

[Report Description]

MID market to grow at significant rate during 2018–2023
The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Key factors driving the growth of the MID market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. However, the technological monopoly of LDS equipment manufacturer is a major factor restraining the growth of the market.

Sensors to boost MID market growth during forecast period
MIDs are used in sensors for a variety of industrial and automotive applications. Industrial applications include temperature sensors, motion sensors, pressure sensors, and flow sensors, among others. In automotive, MID-based sensors are used in adaptive cruise control system, central locking, and climate control applications. MID miniaturizes devices, which helps reduce the weight of the overall sensor system and increases functionality, resulting in low-cost end-use devices. The use of MID will increase in sensors, which will further drive the MID market growth in the coming years.

Asia Pacific to account for largest size of MID market during forecast period
APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the MID market in this region. This region is expected to witness mass commercialization of 5G by 2020.

Following is the breakup of the profiles of primary participants for the report:
• By Company Type: Tier 1 – 20%, Tier 2 – 55%, and Tier 3 – 25%
• By Designation: C-Level Executives – 45%, Directors – 30%, and Others – 25%
• By Region: North America – 45%, Europe – 30%, APAC – 20%, and RoW – 5%
Key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).

Research Coverage
This research report categorizes the MID market by process, product type, industry, and geography. By process, the market has been segmented into LDS, 2-shot molding, and film techniques. By product type, the MID market has been classified into antennae & connectivity modules, connectors & switches, sensors, lighting, and others. By industry, the market has been segmented into telecommunications, consumer electronics, automotive, medical, and industrial. Moreover, the report covers the market in 4 major regions—North America, Europe, APAC, and RoW.

Key Benefits of Buying This Report
Illustrative segmentation, analysis, and forecast for the market based on process, product type, industry, and geography have been conducted to give an overall view of the MID market.
Major drivers, restraints, opportunities, and challenges pertaining to the MID market have been detailed in this report.
A detailed competitive landscape, including the revenues of key players, has been presented.



TABLE OF CONTENTS

1 INTRODUCTION 12
1.1 STUDY OBJECTIVES 12
1.2 DEFINITION 12
1.3 STUDY SCOPE 13
1.3.1 YEARS CONSIDERED FOR STUDY 13
1.4 CURRENCY 14
1.5 STAKEHOLDERS 14
2 RESEARCH METHODOLOGY 15
2.1 RESEARCH DATA 15
2.1.1 SECONDARY DATA 16
2.1.1.1 Key data from secondary sources 16
2.1.2 PRIMARY DATA 17
2.1.2.1 Key data from primary sources 17
2.1.2.2 Breakdown of primaries 18
2.2 MARKET SIZE ESTIMATION 18
2.2.1 BOTTOM-UP APPROACH 19
2.2.2 TOP-DOWN APPROACH 20
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 21
2.4 RESEARCH ASSUMPTIONS 22
3 EXECUTIVE SUMMARY 23
4 PREMIUM INSIGHT 27
4.1 ATTRACTIVE OPPORTUNITIES FOR MOLDED INTERCONNECT DEVICE MARKET GROWTH 27
4.2 MOLDED INTERCONNECT DEVICE MARKET FOR CONSUMER ELECTRONICS INDUSTRY, BY PRODUCT TYPE 28
4.3 MOLDED INTERCONNECT DEVICE MARKET FOR ANTENNAE AND CONNECTIVITY MODULES, BY INDUSTRY 28
4.4 MOLDED INTERCONNECT DEVICE MARKET IN EUROPE, BY PROCESS 29
4.5 MOLDED INTERCONNECT DEVICE MARKET, BY REGION 30

5 MARKET OVERVIEW 31
5.1 INTRODUCTION 31
5.2 MARKET DYNAMICS 31
5.2.1 DRIVERS 32
5.2.1.1 Increasing use of MID in medical devices 32
5.2.1.2 Rising demand for miniaturization in consumer electronics industry 32
5.2.1.3 Increasing need to reduce e-waste 32
5.2.2 RESTRAINTS 32
5.2.2.1 Technological monopoly of LDS equipment manufacturer 32
5.2.3 OPPORTUNITIES 33
5.2.3.1 Rising use of MID in automotive industry 33
5.2.3.2 Growth in IoT devices 33
5.2.4 CHALLENGES 33
5.2.4.1 Incompatibility with electronic packages 33
6 INDUSTRY TRENDS 34
6.1 INTRODUCTION 34
6.2 IN-MOLD ELECTRONICS (IME) 34
6.2.1 APPLICATIONS 34
6.2.2 BUILDING BLOCKS 34
7 MOLDED INTERCONNECT DEVICE MARKET, BY PROCESS 35
7.1 INTRODUCTION 36
7.2 LASER DIRECT STRUCTURING 36
7.3 2-SHOT MOLDING 36
7.4 FILM TECHNIQUES 36
8 MOLDED INTERCONNECT DEVICE MARKET, BY PRODUCT TYPE 37
8.1 INTRODUCTION 38
8.2 ANTENNAE AND CONNECTIVITY MODULES 38
8.3 SENSORS 39
8.4 CONNECTORS AND SWITCHES 40
8.5 LIGHTING 40
8.6 OTHERS 41
9 MOLDED INTERCONNECT DEVICE MARKET, BY INDUSTRY 42
9.1 INTRODUCTION 43
9.2 TELECOMMUNICATIONS 43
9.3 CONSUMER ELECTRONICS 44
9.4 AUTOMOTIVE 45
9.5 MEDICAL 46
9.6 INDUSTRIAL 47
10 GEOGRAPHIC ANALYSIS 48
10.1 INTRODUCTION 49
10.2 NORTH AMERICA 51
10.2.1 US 53
10.2.2 CANADA 53
10.3 EUROPE 54
10.3.1 GERMANY 56
10.3.2 SWITZERLAND 56
10.3.3 FRANCE 56
10.3.4 REST OF EUROPE 56
10.4 ASIA PACIFIC (APAC) 57
10.4.1 CHINA 59
10.4.2 JAPAN 59
10.4.3 SOUTH KOREA 59
10.4.4 REST OF APAC 59
10.5 REST OF THE WORLD (ROW) 59
10.5.1 SOUTH AMERICA 61
10.5.2 MIDDLE EAST AND AFRICA 61
11 COMPETITIVE LANDSCAPE 62
11.1 INTRODUCTION 62
11.2 MARKET PLAYER RANKING ANALYSIS 63
11.3 COMPETITIVE SITUATIONS AND TRENDS 64
11.3.1 EXPANSIONS 64
11.3.2 MERGER AND ACQUISITIONS 64
11.3.3 PRODUCT DEVELOPMENT 65
11.3.4 AGREEMENT 65
12 COMPANY PROFILES 66
12.1 INTRODUCTION 66
12.2 KEY PLAYERS 67
(Business overview, Products offered, Recent developments, MNM view, SWOT analysis)*
12.2.1 MOLEX 67
12.2.2 LPKF LASER & ELECTRONICS 69
12.2.3 TE CONNECTIVITY 71
12.2.4 HARTING 73
12.2.5 ARLINGTON PLATING COMPANY 75
12.2.6 JOHNAN 77
12.2.7 MID SOLUTIONS 78
12.2.8 2E MECHATRONIC 79
12.2.9 MULTIPLE DIMENSIONS 80
*Business overview, Products offered, Recent developments, MNM view, SWOT analysis might not be captured in case of unlisted companies.
12.3 OTHER IMPORTANT PLAYERS 81
12.3.1 LASER MICRONICS 81
12.3.2 TEPROSA 81
12.3.3 AXON CABLE 82
12.3.4 S2P 82
12.3.5 SUZHOU CICOR TECHNOLOGY CO. LTD 82
12.3.6 IME VENDORS 83
12.3.6.1 DowDUPont 83
12.3.6.2 TactoTek 83
12.3.6.3 Dura Tech Industries 84
12.3.6.4 Tekra 84
12.3.6.5 Yomura Technologies 84
13 APPENDIX 85
13.1 INSIGHTS OF INDUSTRY EXPERTS 85
13.2 DISCUSSION GUIDE 86
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 88
13.4 AVAILABLE CUSTOMIZATIONS 90
13.5 RELATED REPORTS 90
13.6 AUTHOR DETAILS 91

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